CHAPTER 8: SAMPLE CONTACTS

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FIG. 8.1
Representative values of specific contact resistivity for high-Tc superconductors

FIG. 8.2
Spring contact for convenient, quick changing of voltage contacts when testing many samples

FIG. 8.3
Indium-pressure contacts for relatively low-current tapes

FIG. 8.4
Auger electron spectroscopy depth profile for three contacts to YBCO: (a) indium-solder contact; (b) Ag/YBCO contact; and (c) Ag/YBCO contact fully oxygen annealed at 600°C for 1 h

FIG. 8.5
Contact resistivity of Ag/YBCO interfaces at 4 K as a function of exposure time to air, CO2, N2, O2, and vacuum

FIG. 8.6
Oxygen annealing characteristic for silver and gold contacts on sintered bulk YBCO

FIG. 8.7
Oxygen annealing characteristic for silver contacts on bare bulk-sintered bismuth-based superconductors

FIG. 8.8
Oxygen annealing characteristic for silver contacts on bare bulk-sintered thallium-based superconductors

FIG. 8.9
Furnace arrangement for counter-flow oxygen annealing of high-Tc superconductor contacts

FIG. 8.10
Diagram of contact resistance measurement technique

FIG. 8.11
Effect of ion energy on sputter yield for sputter cleaning of contact surfaces

FIG. 8.12
Contact resistivity as a function of annealing temperature for two silver thin-film contacts deposited on YBCO films

FIG. 8.13
Optical micrograph of silver film annealed at 500°C, showing extensive agglomeration of silver that results in loss of electrical continuity through the contact pad

FIG. 8.14
Contact resistivity as a function of annealing temperature for two gold thin films deposited on YBCO films

FIG. 8.15
Configurations for measuring film interface resistivity

FIG. 8.16
Stitch-bond arrangement for measuring the contact resistivity of wire-bond or ribbon-bond connections

FIG. 8.17
Spreading resistance effect in thin contact pads

References
Listing of all References for Chapter 8 Figures