CHAPTER 8: SAMPLE CONTACTS

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FIG. 8.1: Representative values of specific contact resistivity for high-Tc superconductors

FIG. 8.2: Spring contact for convenient, quick changing of voltage contacts when testing many samples

FIG. 8.3: Indium-pressure contacts for relatively low-current tapes

FIG. 8.4: Auger electron spectroscopy depth profile for three contacts to YBCO: (a) indium-solder contact; (b) Ag/YBCO contact; and (c) Ag/YBCO contact fully oxygen annealed at 600°C for 1 h

FIG. 8.5: Contact resistivity of Ag/YBCO interfaces at 4 K as a function of exposure time to air, CO2, N2, O2, and vacuum

FIG. 8.6: Oxygen annealing characteristic for silver and gold contacts on sintered bulk YBCO

FIG. 8.7: Oxygen annealing characteristic for silver contacts on bare bulk-sintered bismuth-based superconductors

FIG. 8.8: Oxygen annealing characteristic for silver contacts on bare bulk-sintered thallium-based superconductors

FIG. 8.9: Furnace arrangement for counter-flow oxygen annealing of high-Tc superconductor contacts

FIG. 8.10: Diagram of contact resistance measurement technique

FIG. 8.11: Effect of ion energy on sputter yield for sputter cleaning of contact surfaces

FIG. 8.12: Contact resistivity as a function of annealing temperature for two silver thin-film contacts deposited on YBCO films

FIG. 8.13: Optical micrograph of silver film annealed at 500°C, showing extensive agglomeration of silver that results in loss of electrical continuity through the contact pad

FIG. 8.14: Contact resistivity as a function of annealing temperature for two gold thin films deposited on YBCO films

FIG. 8.15: Configurations for measuring film interface resistivity

FIG. 8.16: Stitch-bond arrangement for measuring the contact resistivity of wire-bond or ribbon-bond connections

FIG. 8.17: Spreading resistance effect in thin contact pads

References: Listing of all References for Chapter 8 Figures